C.Y. Khor (Chu Yee Khor) received the bachelor degree in mechanical engineering, and the M.Sc and Ph.D. degrees in Mechanical Engineering, specializing in electronic packaging from Universiti Sains Malaysia, Minden, Malaysia, in 2008, 2010 and 2013, respectively. He was a Post-Doctoral Fellow at School of Mechanical Engineering, Universiti Sains Malaysia, 2014. Currently, he is a senior lecturer at the Faculty of Engineering Technology, Universiti Malaysia Perlis (UniMAP), Perlis, Malaysia. Dr Khor is a journal reviewers of Microelectronics Reliability, Heat and Mass Transfer, International Journal of Heat and Mass Transfer, Arabian Journal for Science and Engineering, Soldering & Surface Mount Technology, Journal of Electronic Packaging, Microelectronics International, etc.

Google Scholar: http://scholar.google.com/citations?user=FT2Bqo8AAAAJ  

ResearchGate: https://www.researchgate.net/profile/CY_Khor

Publon: https://publons.com/researcher/1485777/cy-khor/